설명

Single Wafer Processing

환경 설정

Currently Configured for: 300mm Current Equipment Status: Available Available date: Currently Available The equipment use of destructive methods to deinstallation the equipment. Damage/Missing parts list, please inspect tool to reconfirm. Dry pumps and customer provided items not included on sales. Inspect to confirm configuration and condition. The DC Power supply is missing and Heater is damaged. Install Type is Stand-Alone Date of last PM is 2014 The system not On-Line SEZ Spin Processor Model is SP304 UI (Front) is present Status Lamp is present Chuck Size (Left) is 12 Chuck Size (Right) is 12 Ionizer system No Flip Module No End Point Detection System Horiba concentration Monitor (HF Monitor) ULPA Filter (Top of Main Unit) FFU Replacement Date is 2013 Robot Support Plate is Present Robot - CNTRL Filter Replacement Date is 2013 Suck Back Box w/NT flow meter & manual reset Number of Load-ports is 2 std Load-port Size (Left) is 12 Load-port Size (Right) is 12 No Load-port Adapters (12->8) No Wafer ID Reader No RFID Reader Chemical Module 1 is SC1 Chemical Module 2 is HF 49% Chemical Module 3 is H2SO4 Chemical Delivery System (CDS) is CDS Buffer System for Chemical Cabinet No Bulk Chem Delivery system (BCD)_Active No Bulk Chem Delivery system (BCD)_Passive All Cables are present There are missing or damaged parts