설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.문서
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SEMITOOL
EQUINOX
검증됨
카테고리
Wet Processing / Wafer Cleaning
마지막 검증일: 15일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
112447
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
SEMITOOL
EQUINOX
카테고리
Wet Processing / Wafer Cleaning
마지막 검증일: 15일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
112447
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.문서
문서 없음