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SHINKAWA UTC 1000 SUPER
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    OEM 모델 설명
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    문서

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    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon

    검증됨

    카테고리
    Wire / Wedge / Ball Bonder

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    86592


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    2006


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonder
    빈티지: 2006조건: 중고
    마지막 검증일어제

    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon
    검증됨
    카테고리
    Wire / Wedge / Ball Bonder
    마지막 검증일: 60일 이상 전
    listing-photo-4d13c35459404af0b24e2b869b87fd94-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    86592


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    2006


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    문서

    문서 없음

    유사 등재물
    모두 보기
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonder빈티지: 2006조건: 중고마지막 검증일:어제
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonder빈티지: 2005조건: 중고마지막 검증일:어제
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonder빈티지: 2006조건: 중고마지막 검증일:어제