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ASM EAGLE 60AP
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    OEM 모델 설명
    The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
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    검증됨

    카테고리
    Wire / Wedge / Ball Bonder

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    60472


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2008


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonder
    빈티지: 2008조건: 중고
    마지막 검증일60일 이상 전

    ASM

    EAGLE 60AP

    verified-listing-icon
    검증됨
    카테고리
    Wire / Wedge / Ball Bonder
    마지막 검증일: 60일 이상 전
    listing-photo-b6ffcd8f880d45a8be9ba952b0e4c1d7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/28190/b6ffcd8f880d45a8be9ba952b0e4c1d7/ebcc6985698f4a9c99492124925123d5_f63c9973b11c40438ec4852370c3a35445005c_mw.jpeg
    listing-photo-b6ffcd8f880d45a8be9ba952b0e4c1d7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/28190/b6ffcd8f880d45a8be9ba952b0e4c1d7/f70a77468ef7456091a21ec6258c689f_07471492679545a989817a5c7dec5b7645005c_mw.jpeg
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    60472


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2008


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
    문서

    문서 없음

    유사 등재물
    모두 보기
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonder빈티지: 2008조건: 중고마지막 검증일:60일 이상 전
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonder빈티지: 2012조건: 중고마지막 검증일:60일 이상 전
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonder빈티지: 2006조건: 중고마지막 검증일:60일 이상 전