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ASM EAGLE 60AP
  • ASM EAGLE 60AP
  • ASM EAGLE 60AP
  • ASM EAGLE 60AP
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OEM 모델 설명
The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
문서

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PREFERRED
 
SELLER
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검증됨

카테고리
Wire / Wedge / Ball Bonder

마지막 검증일: 60일 이상 전

Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

114340


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PREFERRED
 
SELLER

ASM

EAGLE 60AP

verified-listing-icon
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
listing-photo-e3600269f88b4d4b8a1cb5b7bc9ac9f4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

114340


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
환경 설정 없음
OEM 모델 설명
The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
문서

문서 없음

유사 등재물
모두 보기