설명
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.환경 설정
환경 설정 없음OEM 모델 설명
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.문서
문서 없음
ASM
EAGLE XTREME
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79163
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ASM
EAGLE XTREME
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79163
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.환경 설정
환경 설정 없음OEM 모델 설명
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.문서
문서 없음