설명
설명 없음환경 설정
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM 모델 설명
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.문서
문서 없음
카테고리
AOI
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152849
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
카테고리
AOI
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152849
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM 모델 설명
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.문서
문서 없음