설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.문서
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KLA
AIT III
검증됨
카테고리
Defect Inspection
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
82605
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
AIT III
검증됨
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
82605
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.문서
문서 없음