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KLA AIT III
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    The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.
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    KLA

    AIT III

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    카테고리
    Defect Inspection

    마지막 검증일: 21일 전

    주요 품목 세부 정보

    조건:

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    작동 상태:

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    제품 ID:

    102930


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    빈티지:

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    KLA AIT III

    KLA

    AIT III

    Defect Inspection
    빈티지: 0조건: 부품 도구
    마지막 검증일60일 이상 전

    KLA

    AIT III

    verified-listing-icon
    검증됨
    카테고리
    Defect Inspection
    마지막 검증일: 21일 전
    listing-photo-fc5ffc78c7fd4b87a96e4a9264b3a46f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    102930


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.
    문서

    문서 없음

    유사 등재물
    모두 보기
    KLA AIT III

    KLA

    AIT III

    Defect Inspection빈티지: 0조건: 부품 도구마지막 검증일: 60일 이상 전
    KLA AIT III

    KLA

    AIT III

    Defect Inspection빈티지: 0조건: 부품 도구마지막 검증일: 29일 전
    KLA AIT III

    KLA

    AIT III

    Defect Inspection빈티지: 0조건: 부품 도구마지막 검증일: 60일 이상 전