설명
No missing parts환경 설정
* Multi-chip module - Flip chip and die attach tasks can be executed in just one module * Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space * Key specifications Die handling from 0,17 mm - 50 mm, Placement accuracy of ±10 µm @ 3s (cmk = 1,33) * Operator friendly - Despite the wide range of fittings and set-up options, the operation of the 2200 EVO is easy to learn - just as used for the 2200 platform. Date a transfer via TCP/IP networks is naturally implemented, and the user interface is menu-driven. Flexibility - Even the standard module of the 2200 EVO die bonders can be very variably equipped. * Slide flux is not included * Heated options - Heated bond head (up to 350 °C) and substrate heating (up to 150 °C) are available to convert today's and tomorrow's demands of heat-requiring applications.OEM 모델 설명
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.문서
BESI / DATACON
2200 EVO
검증됨
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
89162
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / DATACON
2200 EVO
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
89162
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available