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APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
설명
설명 없음
환경 설정
AMAT Centura II - Frame and Controller only Primary and secondary rack Cardcage with backplane DC Power Filter box Gas box Does not include: Slot PCB (SBC, AIO, DIO) HDD FDD QOB CB (4) / 0190-00596 / MCE, common chamber tray (4) / 0010-01246 / VME2 Assembly, control, MCE (1) / 0010-01409 / Interlock assembly, gas panel, VME2, MCE.
OEM 모델 설명
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."
문서

문서 없음

카테고리
Dry / Plasma Etch

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Parts Tool


작동 상태:

알 수 없음


제품 ID:

69660


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

CENTURA II

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검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
listing-photo-b08b94fc5e5949cfb28ec19b95b6940a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2056/b08b94fc5e5949cfb28ec19b95b6940a/7d202ef8c9504bd7a6c2959c40310f17_a2249462470b48f88fb6167385fadacb_mw.png
listing-photo-b08b94fc5e5949cfb28ec19b95b6940a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2056/b08b94fc5e5949cfb28ec19b95b6940a/1ab1e541557748ce84862a86bad4bced_801ec5bb36164144aeb8837f4ce434b245005c_mw.jpeg
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listing-photo-b08b94fc5e5949cfb28ec19b95b6940a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2056/b08b94fc5e5949cfb28ec19b95b6940a/31a681182a0542e8be863acf43b6510b_62130e483f6f4abcbe4047652bc9ff39_mw.png
주요 품목 세부 정보

조건:

Parts Tool


작동 상태:

알 수 없음


제품 ID:

69660


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
AMAT Centura II - Frame and Controller only Primary and secondary rack Cardcage with backplane DC Power Filter box Gas box Does not include: Slot PCB (SBC, AIO, DIO) HDD FDD QOB CB (4) / 0190-00596 / MCE, common chamber tray (4) / 0010-01246 / VME2 Assembly, control, MCE (1) / 0010-01409 / Interlock assembly, gas panel, VME2, MCE.
OEM 모델 설명
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."
문서

문서 없음