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LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
설명
Metal Etch
환경 설정
환경 설정 없음
OEM 모델 설명
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
문서

문서 없음

카테고리
Dry / Plasma Etch

마지막 검증일: 13일 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

119694


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기

LAM RESEARCH CORPORATION

TCP 9600SE

verified-listing-icon
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 13일 전
listing-photo-0be1b3f91dc049c19e31c5d5704152aa-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

119694


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Metal Etch
환경 설정
환경 설정 없음
OEM 모델 설명
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
문서

문서 없음

유사 등재물
모두 보기