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LAM RESEARCH CORPORATION TCP 9400
  • LAM RESEARCH CORPORATION TCP 9400
  • LAM RESEARCH CORPORATION TCP 9400
  • LAM RESEARCH CORPORATION TCP 9400
설명
Polycrystal dry etching machine
환경 설정
환경 설정 없음
OEM 모델 설명
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.
문서

문서 없음

카테고리
Dry / Plasma Etch

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

112598


웨이퍼 사이즈:

6"/150mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

TCP 9400

verified-listing-icon
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
listing-photo-2c1c2fa0b1a94697add18ebc0e70926c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

112598


웨이퍼 사이즈:

6"/150mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Polycrystal dry etching machine
환경 설정
환경 설정 없음
OEM 모델 설명
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.
문서

문서 없음