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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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PLASMATHERM 790
    설명
    설명 없음
    환경 설정
    PECVD
    OEM 모델 설명
    The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
    문서

    문서 없음

    PLASMATHERM

    790

    verified-listing-icon

    검증됨

    카테고리
    Dry / Plasma Etch

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    100286


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    PLASMATHERM 790

    PLASMATHERM

    790

    Dry / Plasma Etch
    빈티지: 0조건: 중고
    마지막 검증일2일 전

    PLASMATHERM

    790

    verified-listing-icon
    검증됨
    카테고리
    Dry / Plasma Etch
    마지막 검증일: 60일 이상 전
    listing-photo-64bd9918ae82471ab3b0168a3a17208a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    100286


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    PECVD
    OEM 모델 설명
    The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
    문서

    문서 없음

    유사 등재물
    모두 보기
    PLASMATHERM 790

    PLASMATHERM

    790

    Dry / Plasma Etch빈티지: 0조건: 중고마지막 검증일:2일 전
    PLASMATHERM 790

    PLASMATHERM

    790

    Dry / Plasma Etch빈티지: 1993조건: 중고마지막 검증일:10일 전
    PLASMATHERM 790

    PLASMATHERM

    790

    Dry / Plasma Etch빈티지: 0조건: 개조됨마지막 검증일:60일 이상 전