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PLASMATHERM 790
  • PLASMATHERM 790
설명
설명 없음
환경 설정
790 RIE System - Max wafer size capable: 8"/200mm - RFPP RF5S 500W RF Generator - Leybold 361C Turbo Pump (Qty 1) - Leybold NT 150/360 Controller - MKS 1160B MFCs (gas configuration listed below) - Chiller - Edwards QDP40 Dry Pump (or equivalent) - Operator Manual and Documentation Gas Configuration consists of: - O2 200sccm - H2 100sccm - CH4 20sccm - CHF3 200sccm Single RIE Chamber Ideal for R&D
OEM 모델 설명
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
문서

문서 없음

카테고리
Dry / Plasma Etch

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

19003


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

PLASMATHERM

790

verified-listing-icon
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
listing-photo-mH6ezA2G6pSHTmIHJokMW1jJmmuof34aILxGiZMXLLo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/mH6ezA2G6pSHTmIHJokMW1jJmmuof34aILxGiZMXLLo/88bb932bdd394fe08fab99577b935ae3_214783e4b0834f0baa1b0df66de1b5a01201a_mw.jpeg
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

19003


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
790 RIE System - Max wafer size capable: 8"/200mm - RFPP RF5S 500W RF Generator - Leybold 361C Turbo Pump (Qty 1) - Leybold NT 150/360 Controller - MKS 1160B MFCs (gas configuration listed below) - Chiller - Edwards QDP40 Dry Pump (or equivalent) - Operator Manual and Documentation Gas Configuration consists of: - O2 200sccm - H2 100sccm - CH4 20sccm - CHF3 200sccm Single RIE Chamber Ideal for R&D
OEM 모델 설명
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
문서

문서 없음