설명
The system includes 2” and 4” platens환경 설정
790+ RIE CF4 CHF3 Ar O2 N2OEM 모델 설명
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
127361
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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PLASMATHERM
790
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
127361
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The system includes 2” and 4” platens환경 설정
790+ RIE CF4 CHF3 Ar O2 N2OEM 모델 설명
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.문서
문서 없음