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ESI 9830
  • ESI 9830
설명
No missing parts and It include the HDD with the software also
환경 설정
환경 설정 없음
OEM 모델 설명
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
문서

문서 없음

PREFERRED
 
SELLER
verified-listing-icon

검증됨

카테고리
Laser

마지막 검증일: 60일 이상 전

Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

Deinstalled


제품 ID:

117593


웨이퍼 사이즈:

알 수 없음


빈티지:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

ESI

9830

verified-listing-icon
검증됨
카테고리
Laser
마지막 검증일: 60일 이상 전
listing-photo-023b6742a37541ba9d2f1cacbab89e77-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1746/023b6742a37541ba9d2f1cacbab89e77/0b881c4743fe46e09d1e0d4c92712bc9_1_mw.png
Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

Deinstalled


제품 ID:

117593


웨이퍼 사이즈:

알 수 없음


빈티지:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
No missing parts and It include the HDD with the software also
환경 설정
환경 설정 없음
OEM 모델 설명
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
문서

문서 없음