설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.문서
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ESI
9830
검증됨
카테고리
Laser
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
25436
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ESI
9830
카테고리
Laser
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
25436
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.문서
문서 없음