설명
Oxford Plasmalab 133+ RIE CL Reactive Ion Etcher Windows PC, user friendly interface GUI환경 설정
Supports wafer sizes up to 300mm (330mm Platen) Mechanical chuck RIE set up for GaN Etch RF Power: 600W, 13.56MHz Water cooled electrode 10C-80C End point detection: Verity Optical emission spectroscopy (200-800nm) Gas pod with 8 lines including following 7 MFCs: Ar – 100sccm CL2 – 100sccm BCL3 – 100sccm N2O – 200sccm CHF3 – 200sccm NH3 -100sccm CH4 – 50sccmOEM 모델 설명
The Oxford Plasmalab 133 is a system used for plasma etching through a process called Reactive Ion Etching (RIE). This refurbished system is designed for GaN etching and has a platen that measures 330mm. It has an RF power of 600W at a frequency of 13.56MHz and features a water-cooled electrode that can operate within a temperature range of 10°C to 80°C. The system also includes a load lock with a turbo pump and an end-point detection system that utilizes Verity Optical emission spectroscopy within the range of 200-800nm. The gas pod of the system has six lines, including mass flow controllers for gases such as Ar, CL, BCL3, and N2O.문서
문서 없음
카테고리
PECVD
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
138678
웨이퍼 사이즈:
12"/300mm
빈티지:
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
OXFORD
PLASMALAB 133
카테고리
PECVD
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
138678
웨이퍼 사이즈:
12"/300mm
빈티지:
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Oxford Plasmalab 133+ RIE CL Reactive Ion Etcher Windows PC, user friendly interface GUI환경 설정
Supports wafer sizes up to 300mm (330mm Platen) Mechanical chuck RIE set up for GaN Etch RF Power: 600W, 13.56MHz Water cooled electrode 10C-80C End point detection: Verity Optical emission spectroscopy (200-800nm) Gas pod with 8 lines including following 7 MFCs: Ar – 100sccm CL2 – 100sccm BCL3 – 100sccm N2O – 200sccm CHF3 – 200sccm NH3 -100sccm CH4 – 50sccmOEM 모델 설명
The Oxford Plasmalab 133 is a system used for plasma etching through a process called Reactive Ion Etching (RIE). This refurbished system is designed for GaN etching and has a platen that measures 330mm. It has an RF power of 600W at a frequency of 13.56MHz and features a water-cooled electrode that can operate within a temperature range of 10°C to 80°C. The system also includes a load lock with a turbo pump and an end-point detection system that utilizes Verity Optical emission spectroscopy within the range of 200-800nm. The gas pod of the system has six lines, including mass flow controllers for gases such as Ar, CL, BCL3, and N2O.문서
문서 없음