설명
The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers. Handler Type MX800. 5x Pulsed DC chambers with RF on Chuck환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음
카테고리
PVD / Sputtering
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136261
웨이퍼 사이즈:
6"/150mm
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
카테고리
PVD / Sputtering
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136261
웨이퍼 사이즈:
6"/150mm
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers. Handler Type MX800. 5x Pulsed DC chambers with RF on Chuck환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음