설명
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.환경 설정
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 모델 설명
미제공문서
문서 없음
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
102898
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
102898
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.환경 설정
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 모델 설명
미제공문서
문서 없음