설명
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.환경 설정
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 모델 설명
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EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
검증됨
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
102898
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
102898
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.환경 설정
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEM 모델 설명
미제공문서
문서 없음