설명

Dicing

환경 설정

-Software Ver．2.50 -Spindle Torque： 1.8kW -Chuck Table： Φ200 Porous -Spinner Table： 8 inch Porous -Transport section Ionizer： None -Blade attachment： With Flange -Spinner cleaning Nozzle： 2-Fluid Nozzle -UV mechanism： None -Recognition Camera： CCD Utility： ITEM: SPECIFICATION POWER: 3WIRE+GROUND CUTTING WATER: RC3/8 AIR: RC1/4 COOLING WATER (IN): RC1/4 COOLING WATER（OUT): RC1/4 EXHAUST DUCT: φ101.6mm DRAINAGE DUCT: φ50.6mm

OEM 모델 설명

The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.