설명
Working condition, No missing환경 설정
환경 설정 없음OEM 모델 설명
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.문서
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DISCO
DFD6341
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
108438
웨이퍼 사이즈:
8"/200mm
빈티지:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Working condition, No missing환경 설정
환경 설정 없음OEM 모델 설명
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.문서
문서 없음