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설명
Working condition, No missing환경 설정
Software Ver. 2.50 Spindle Torque: l .8kW Chuck Table: None Spinner Table: 8 inch Porous Transport section Ionizer: None Blade attachment: No Flange Spinner cleaning Nozzle: 2-Fluid Nozzle UV mechanism: None Recognition Camera: CCD Utility: ITEM SPECIFICATION POWER 3WIRE+GROUND CUTTING WATER RC3/8 IR RC1/4 COOLING WATER(IN) RC1/4 COOLING WATER(OUT) RC1/4 EXHAUST DUCT ¢ 101.6mm DRAINAGE DUCT ¢ 50.6mmOEM 모델 설명
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.문서
유사 등재물
모두 보기
DISCO
DFD6341
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
108439
웨이퍼 사이즈:
8"/200mm
빈티지:
2017
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