설명
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.환경 설정
환경 설정 없음OEM 모델 설명
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.문서
문서 없음
유사 등재물
모두 보기
DISCO
DAG810
카테고리
Wafer Grinding
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
140557
웨이퍼 사이즈:
알 수 없음
빈티지:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.환경 설정
환경 설정 없음OEM 모델 설명
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.문서
문서 없음