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설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.문서
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DISCO
DFG841
검증됨
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
111210
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DFG841
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
111210
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.문서
문서 없음