설명
Thinning machine환경 설정
Back-side GrinderOEM 모델 설명
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.문서
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DISCO
DFG841
카테고리
Wafer Grinding
마지막 검증일: 28일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136861
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Thinning machine환경 설정
Back-side GrinderOEM 모델 설명
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.문서
문서 없음