설명
Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.문서
문서 없음
DISCO
DFG850
검증됨
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79199
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DFG850
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79199
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.문서
문서 없음