설명
설명 없음환경 설정
as-is no missing parts can turn onOEM 모델 설명
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.문서
문서 없음
DISCO
DFG850
검증됨
카테고리
Wafer Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Down
제품 ID:
73566
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFG850
카테고리
Wafer Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Down
제품 ID:
73566
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
as-is no missing parts can turn onOEM 모델 설명
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.문서
문서 없음