설명
Backside grind환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.문서
문서 없음
DISCO
DFG8560
검증됨
카테고리
Wafer Grinding
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118476
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기DISCO
DFG8560
카테고리
Wafer Grinding
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118476
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Backside grind환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.문서
문서 없음