설명
Disco - DFG8560 Grinder환경 설정
Historical Usage: Less than 3,400 wafers processed, 170 hours total grinding time Standard Equipment / Configuration 300mm maximum wafer size; minimum wafer size 8-inch Two 4.8 kW air-bearing spindles Wafer rotation table with two-cassette flow and spinner washing unit Vacuum unit with coolant tank for supplying water to the grinding wheels Three universal chuck tables (8-inch–12-inch type) Height sensor for monitoring wafer thickness during grinding Three grinding wheels — coarse, fine, and self-grind Three dresser boards — coarse, fine, and self-grind 5mm block gauge and run-out measurement jig Complete set of manuals Windows-based operating system with graphical user interface Transportation jig / hoist Standard required tool set Additional Options / Special Features 8-inch and 12-inch Thin Grinding Kit — YFJV27-01A DTU152 spindle cooling recirculating temperature controller — YFJV12-02A Auto wheel setup — YFJV16-01AOEM 모델 설명
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.문서
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DISCO
DFG8560
카테고리
Wafer Grinding
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
154533
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Disco - DFG8560 Grinder환경 설정
Historical Usage: Less than 3,400 wafers processed, 170 hours total grinding time Standard Equipment / Configuration 300mm maximum wafer size; minimum wafer size 8-inch Two 4.8 kW air-bearing spindles Wafer rotation table with two-cassette flow and spinner washing unit Vacuum unit with coolant tank for supplying water to the grinding wheels Three universal chuck tables (8-inch–12-inch type) Height sensor for monitoring wafer thickness during grinding Three grinding wheels — coarse, fine, and self-grind Three dresser boards — coarse, fine, and self-grind 5mm block gauge and run-out measurement jig Complete set of manuals Windows-based operating system with graphical user interface Transportation jig / hoist Standard required tool set Additional Options / Special Features 8-inch and 12-inch Thin Grinding Kit — YFJV27-01A DTU152 spindle cooling recirculating temperature controller — YFJV12-02A Auto wheel setup — YFJV16-01AOEM 모델 설명
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.문서
문서 없음