설명
DGP8760+DFM2700환경 설정
Process: Backgrinding Mode: Fully-autoOEM 모델 설명
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.문서
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유사 등재물
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DISCO
DGP8760
카테고리
Wafer Polishing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116459
웨이퍼 사이즈:
알 수 없음
빈티지:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
DGP8760+DFM2700환경 설정
Process: Backgrinding Mode: Fully-autoOEM 모델 설명
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.문서
문서 없음