설명
SP203 with 3 Chemistry Cabinets Power Requirements 200-208 V 50.0 A 50/60 Hz 3 Phase환경 설정
6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8; 3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3: Maintank; Chemistry Controller-DosOEM 모델 설명
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.문서
문서 없음
카테고리
Wet Etch
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
142800
웨이퍼 사이즈:
6"/150mm
빈티지:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / SEZ
SP203
카테고리
Wet Etch
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
142800
웨이퍼 사이즈:
6"/150mm
빈티지:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
SP203 with 3 Chemistry Cabinets Power Requirements 200-208 V 50.0 A 50/60 Hz 3 Phase환경 설정
6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8; 3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3: Maintank; Chemistry Controller-DosOEM 모델 설명
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.문서
문서 없음