설명
Wire Bonder환경 설정
환경 설정 없음OEM 모델 설명
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.문서
문서 없음
ASM
EAGLE XTREME
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
111738
웨이퍼 사이즈:
알 수 없음
빈티지:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ASM
EAGLE XTREME
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
111738
웨이퍼 사이즈:
알 수 없음
빈티지:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wire Bonder환경 설정
환경 설정 없음OEM 모델 설명
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.문서
문서 없음