AJA is a manufacturer of thin film deposition systems including magnetron sputtering, e-beam evaporation, thermal evaporation, and ion milling systems.

ATC-2030-E HV. 6 pocket rotary e-beam source with load-lock, water-cooled substrate holder, and front side radiant substrate heating.

AJA INTERNATIONAL, INC

ATC-2030-E HV

ATC 2030-T Box Coater. Thermal box coater with LN2 substrate cooling, (4) AJA 300A thermal sources and a turbopumped vacuum load-lock..

ATC 2030-T

ATC-E SERIES E-BEAM EVAPORATION SYSTEMS.
ATC 2200-E. 22" diameter, 36" high UHV e-beam evaporator with (6) pocket, linear UHV e-beam source, (2) Radak thermal evaporators and turbo-pumped load-lock.  

ATC 2200-E

ATC 2200-T UHV with Load-Lock. This versatile UHV tool can accommodate either 6 Radak Evaporation Furnaces or a 6 Pocket Linear E Beam Source on a convenient slide mechanism.  It also features (6) QCM heads with isolation tubes for controlled co-deposition.  A gridded ion source and numerous thermal sources are also offered.

ATC 2200-T UHV

ATC Orion 8-T. Fitted with (3) Luxel Radak furnaces, and 850°C substrate heater and a turbo-pumped vacuum load-lock.

ATC ORION 8-T

ATC Orion 5-T. Featuring (3) AJA thermal sources with and an 850°C substrate heater.

ATC ORION 5-T

ATC-E SERIES E-BEAM EVAPORATION SYSTEMS.
ATC-2030-E. A box coater with multi pocket rotary e-beam source and dual thermal sources. This model was fitted with a (4) x 4" wafer flat planetary substrate holder.

ATC-2030-E

ATC-E SERIES E-BEAM EVAPORATION SYSTEMS.
ATC-2036-E HV. 6 pocket rotary e-beam source with 1000°C substrate heating, and programmable linear substrate shutter for wedge films.

ATC-2036-E HV

ST20 

ATC-B-2436. For CD mastering, this system handles one rotating substrate at a time and employs a  single AJA Nautilus Series Rotating magnetron for optimum uniformity.

ATC-B-2436

ATC 1800 T UHV. Accommodates up to (4) Radak Furnaces and a 4cm K&R gridded ion source for pre-cleaning and ion assisted thermal deposition.  The sources include individual QCM isolation tubes to allow controlled co-deposition and an 850°C substrate heater.

ATC 1800 T UHV

ATC-Orion 5 UHV with Load-Lock. Fitted with up to (5) 2" UHV magnetron sputter sources.

ATC-ORION 5 UHV

ATC 2200-H Horizontal Sputter Coater. Capable of coating concave, 25 mm thick, X-ray mirror substrates up to 300 mm in diameter with +/- 2% uniformity utilizing (4) in-situ tilt sputter guns.  The substrate carrier can also be replaced by planetary tooling for a batch of 3D objects or small wafers or coupons.

ATC 2200-H

ATC 2600 UHV. (12) Source direct sputter coater for (8) 1" samples.  Sample positioning is stepper motor controlled and programmable.

ATC 2600 UHV

ATC-E SERIES E-BEAM EVAPORATION SYSTEMS.
ATC-Orion-8E UHV. Compact, economical UHV coater with 5 Pocket Linear E Beam Source on convenient slide mechanism for loading and service. System also features turbo-pumped vacuum load-lock.

ATC-ORION-8E UHV

For coating substrates up to 300mm in diameter, this system accommodates up to (4) 4” sputtering sources simultaneously using (2) sources at different angles to uniformly coat 300mm  Ø area. This tool also includes a broad beam End Hall ion source for substrate pre-clean and sample preparation.

ATC-H-2020

ATC 2200-V: 22" diameter x 17" deep (Standard Chamber Size)

ATC 2200-V

AJA INTERNATIONAL, INC’s ATC 1800 is a versatile PVD coating tool that can be built in a variety of configurations to satisfy most requirements. It is part of the ATC Flagship Series Sputtering Systems and is built around AJA’s unique A300-XP (UHV) or Stiletto Series (HV) magnetron sputtering sources which feature in-situ source head tilting allowing precise and repeatable con-focal, direct, and off-axis thin film deposition. The ATC 1800 can be built in a variety of configurations to satisfy most requirements. For example, it can be fitted with (5) 2" magnetrons with in-situ tilt. These versatile sputtering systems can also be fitted with other deposition sources (e-beam evaporation, thermal evaporation and PLD), ion sources, facing target sputtering sources (FTS), contact masking systems, metal-sealed tops, bake jackets, glove boxes, cassettes, auto-loading and analytical tools (RHEED, XPS, Auger, RGA, Ellipsometers and MOS).

ATC 1800-V

ATC 2200-UHV-DMD. The bake jacketed UHV system above is configured to coat up to (4) 4" diameter, 1" thick Ge substrates per batch from both sides by utilizing an in-situ substrate pallet flipping mechanism. 

ATC 2200-UHV-DMD

ATC 2200 UHV. (6) A330-XP 3" UHV sputter sources with in-situ tilt, 1200 l/s turbopump, 800°C, rotating substrate heater with RF bias, computer control and automated (9) substrate cassette elevator in the load-lock for 150 mm Ø substrates.

ATC 2200 UHV

ATC 1500-F

ATC-Orion 8 HV. Fitted with up to (5) 3" or (8) 2" HV magnetron sputter sources. This unit features a HiPIMS power supply.

ATC-ORION 8 HV 

ATC-B-2848. Small in-line coater designed to utilize AJA STXL rectangular magnetrons to coat multiple substrates on a moving pallet. The pictured system was used to make large quantities of 1mm x 5xmm, temperature sensitive Platinum on ceramic sensors for use in thermostats.

ATC-B-2848

ATC-Orion 8 UHV. Fitted with up to (5) 3" or (8) 2" UHV  magnetron sputtering sources.  This unit features a turbo-pumped vacuum load lock with 6 position cassette.

ATC-Orion 8 HV 
Fitted with up to (5) 3" or (8) 2" HV magnetron sputter sources. This unit features a HiPIMS power supply.

ATC-ORION 8 UHV

ATC-B-3400-H. Extended process side sputtering batch coater designed for a proprietary application requiring 40-50 thousand layers per run.  Custom AJA STXL-EO (extended operation) magnetrons were designed to prevent aborted processing due to source shorting.  This system will process (8) 6" substrates or hundreds of smaller substrates per batch.

ATC-B-3400-H

ATC 1800 UHV. (5) con-focal A320-XP 2" UHV sputter sources with in-situ tilt, (1) normal incidence A330-XP-3” UHV sputtering source for high rate applications, CTI-8 cryopump, 850°C rotating substrate heater with RF bias, computer control & load-lock for 100 mm Ø substrates.

ATC 1800 UHV

ATC-B-3400. Mask making tool processes (6) 8" wafers per batch with up to (3) materials deposited from AJA TR5313 triangular magnetrons for optimum uniformity. The system also includes a 7 substrate cassette in the load-lock to boost throughput up to (60) 8" substrates (or thousands of small substrates) per 8 hour period.

ATC-B-3400

ATC-2020-IM equipped with a 14cm, gridded, RF ion source positioned for uniform milling of a 100mm Ø substrate. System features a 700 l/s turbopump, computer control, SIMS end point detection, and substrate holder with motorized tilting, rotation, and water cooling. ATC-2020-IM (Internal view) Features a 14cm, gridded, RF ion source with hollow cathode neutralizer, 6” substrate holder  with motorized/programmable +/- 90° tilt angle control, azimuthal rotation, water cooling,  and SIMS end point detection.


ATC-2020-IM

The system shown above is equipped with a RF 22cm gridded ion source positioned for uniform milling of a 150mm Ø substrate. System features a 2000 l/s turbopump, computer control, SIMS end point detection, (2) sputtering sources for depositing passivation layers, and substrate holder with motorized tilting, rotation, and water cooling. Etch rate is 320 Å/min of SiO2 with +/- 2% uniformity.

ATC-2036-IM

ATC-1800-IM-R utilizing a 14cm, gridded, RF ion source for uniform, reactive milling of a 100mm Ø substrate and features a 2000 l/s turbopump, computer control, retractable faraday cup, load-lock with sputter gun for passivation layers, and a substrate holder with motorized tilting, heating/cooling (5-200°C).  This tool is also compatible with Cl gas and includes a (4) MFC hazardous gas box.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

AJA INTERNATIONAL, INC

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ATC-2030-E HV

ATC 2030-T

ATC 2200-E

ATC 2200-T UHV

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