설명
Complete, working condtion환경 설정
O2, Ar, CF4, SF6, CHF3. Can use H2 as well.OEM 모델 설명
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
142297
웨이퍼 사이즈:
알 수 없음
빈티지:
1993
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PLASMATHERM
790
카테고리
Dry / Plasma Etch
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
142297
웨이퍼 사이즈:
알 수 없음
빈티지:
1993
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Complete, working condtion환경 설정
O2, Ar, CF4, SF6, CHF3. Can use H2 as well.OEM 모델 설명
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.문서
문서 없음