설명
설명 없음환경 설정
Model = MESC Multiplex ICP ASE Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch) Description of Process = ASE (Advanced Silicon Etch, Bosch Process) Wafer Size = 150mm Loader capacity = 2 wafer Carousel Chuck Type = Mechanical Weighted Clamp Process Gases: C4F8 = 300 Sccms SFG = 600 Sccms O2 = 100 Sccms AR = 100 Sccms Turbo Pump = Leybold Mag 2000 CT RF Generator 1 = ENI ACG-3 RF Generator 2 = AE RFG 3001 (Advanced Energy) Vacuum measurement = MKS Instruments Gate Valve = VAT Throttling Gate Valve Slit Valve = Vat Slit Valve Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue Vacuum Pump Loadlock = Edwards Pump E2M40 Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface) Chiller = Affinity, PWG-060K-BE33CBC2OEM 모델 설명
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.문서
문서 없음
STS
MULTIPLEX ICP
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
64816
웨이퍼 사이즈:
6"/150mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
STS
MULTIPLEX ICP
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
64816
웨이퍼 사이즈:
6"/150mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Model = MESC Multiplex ICP ASE Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch) Description of Process = ASE (Advanced Silicon Etch, Bosch Process) Wafer Size = 150mm Loader capacity = 2 wafer Carousel Chuck Type = Mechanical Weighted Clamp Process Gases: C4F8 = 300 Sccms SFG = 600 Sccms O2 = 100 Sccms AR = 100 Sccms Turbo Pump = Leybold Mag 2000 CT RF Generator 1 = ENI ACG-3 RF Generator 2 = AE RFG 3001 (Advanced Energy) Vacuum measurement = MKS Instruments Gate Valve = VAT Throttling Gate Valve Slit Valve = Vat Slit Valve Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue Vacuum Pump Loadlock = Edwards Pump E2M40 Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface) Chiller = Affinity, PWG-060K-BE33CBC2OEM 모델 설명
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.문서
문서 없음