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설명
M/PLEX Multiplex ICP Etcher환경 설정
Surface Technology Systems M/PLEX Multiplex ICP Etcher, 400V, 50Hz, 3ph, w/ MAG900CT turbopump. Includes power distribution & control rack cabinet, w/ power distribution, Electrogrip electrostatic driver, vAT PM-7 adaptive pressure controller, Leybold Mag Drive 1000 pump controller; ENI ACG-10B RF generator; ENI ACG-3B-06 RF generator; ENI VL-400 phase shift controller; PowerBright VC-2000 step-up/down transformer; BOC Edwards iQDP-80 roughing pump, code# A532-80-905; Neslab RTE-211 recirculating chiller, BOM# 135103200702; gas cabinet; LEP300 control server. Configured for 3in substrates.OEM 모델 설명
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
126234
웨이퍼 사이즈:
3"/75mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
STS
MULTIPLEX ICP
카테고리
Dry / Plasma Etch
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
126234
웨이퍼 사이즈:
3"/75mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
M/PLEX Multiplex ICP Etcher환경 설정
Surface Technology Systems M/PLEX Multiplex ICP Etcher, 400V, 50Hz, 3ph, w/ MAG900CT turbopump. Includes power distribution & control rack cabinet, w/ power distribution, Electrogrip electrostatic driver, vAT PM-7 adaptive pressure controller, Leybold Mag Drive 1000 pump controller; ENI ACG-10B RF generator; ENI ACG-3B-06 RF generator; ENI VL-400 phase shift controller; PowerBright VC-2000 step-up/down transformer; BOC Edwards iQDP-80 roughing pump, code# A532-80-905; Neslab RTE-211 recirculating chiller, BOM# 135103200702; gas cabinet; LEP300 control server. Configured for 3in substrates.OEM 모델 설명
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.문서
문서 없음