설명
Epitaxial Silicon (EPI)환경 설정
Centura Epi 300 (2-chamber) • FFactory interface module configured with dual nitrogen-purged load ports, supporting both FOUP and open cassette wafer handling (OCLP) FI platform version 5.3 Central transfer chamber for wafer movement Magnetically coupled single-blade wafer handling robot with on-the-fly (OTF) centering and wafer-on-blade (WOB) detection capability Pneumatic distribution manifold assembly Two automated batch loadlock chambers equipped with integrated point-of-use vacuum pumps (iPUP) Dual process reactor chambers Upper and lower quartz dome assemblies within each chamber Top and bottom lamp heating modules Wafer support susceptors Jet Pack air cooling subsystem Process exhaust system Low-temperature pyrometry for process monitoring Closed-loop temperature control using optical pyrometers with PID regulation Remote support frame configuration Reduced-pressure next-generation gas delivery panel with integrated mass flow controllers (MFCs) and valve control Safety features including leak detection and system interlocks Vacuum scheme includes a dedicated iPUP for the transfer chamber and remote high-capacity pumps for each process module c300NT system controller running on a Windows NT operating platform Front-end PC (FE PC) providing operator interface and configuration control of the c300NT systemOEM 모델 설명
Applied Centura RP (reduced pressure) Epi systems.문서
문서 없음
카테고리
Epitaxial deposition (EPI)
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
150082
웨이퍼 사이즈:
12"/300mm
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
CENTURA RP EPI
카테고리
Epitaxial deposition (EPI)
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
150082
웨이퍼 사이즈:
12"/300mm
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Epitaxial Silicon (EPI)환경 설정
Centura Epi 300 (2-chamber) • FFactory interface module configured with dual nitrogen-purged load ports, supporting both FOUP and open cassette wafer handling (OCLP) FI platform version 5.3 Central transfer chamber for wafer movement Magnetically coupled single-blade wafer handling robot with on-the-fly (OTF) centering and wafer-on-blade (WOB) detection capability Pneumatic distribution manifold assembly Two automated batch loadlock chambers equipped with integrated point-of-use vacuum pumps (iPUP) Dual process reactor chambers Upper and lower quartz dome assemblies within each chamber Top and bottom lamp heating modules Wafer support susceptors Jet Pack air cooling subsystem Process exhaust system Low-temperature pyrometry for process monitoring Closed-loop temperature control using optical pyrometers with PID regulation Remote support frame configuration Reduced-pressure next-generation gas delivery panel with integrated mass flow controllers (MFCs) and valve control Safety features including leak detection and system interlocks Vacuum scheme includes a dedicated iPUP for the transfer chamber and remote high-capacity pumps for each process module c300NT system controller running on a Windows NT operating platform Front-end PC (FE PC) providing operator interface and configuration control of the c300NT systemOEM 모델 설명
Applied Centura RP (reduced pressure) Epi systems.문서
문서 없음