설명
설명 없음환경 설정
Karl Suss MJB3-IR Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.OEM 모델 설명
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."문서
문서 없음
SUSS MicroTec / KARL SUSS
MJB3
검증됨
카테고리
Mask/Bond Aligners
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
13966
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
SUSS MicroTec / KARL SUSS
MJB3
카테고리
Mask/Bond Aligners
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
13966
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Karl Suss MJB3-IR Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.OEM 모델 설명
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."문서
문서 없음