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설명
설명 없음환경 설정
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEM 모델 설명
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."문서
문서 없음
카테고리
Mask/Bond Aligners
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
62965
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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SUSS MicroTec / KARL SUSS
MJB3
카테고리
Mask/Bond Aligners
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
62965
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEM 모델 설명
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."문서
문서 없음