설명
설명 없음환경 설정
Process: Wafer Dicing Mode: Fully-autoOEM 모델 설명
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.문서
문서 없음
DISCO
DFD6341
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116461
웨이퍼 사이즈:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DFD6341
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116461
웨이퍼 사이즈:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Process: Wafer Dicing Mode: Fully-autoOEM 모델 설명
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.문서
문서 없음