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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFG841
    설명
    설명 없음
    환경 설정
    FULL-AUTO
    OEM 모델 설명
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    문서

    문서 없음

    DISCO

    DFG841

    verified-listing-icon

    검증됨

    카테고리
    Wafer Grinding

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    63113


    웨이퍼 사이즈:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    빈티지:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding
    빈티지: 2000조건: 부품 도구
    마지막 검증일14일 전

    DISCO

    DFG841

    verified-listing-icon
    검증됨
    카테고리
    Wafer Grinding
    마지막 검증일: 60일 이상 전
    listing-photo-74465ec0ba7944308a724d107b79576a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    63113


    웨이퍼 사이즈:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    빈티지:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    FULL-AUTO
    OEM 모델 설명
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    문서

    문서 없음

    유사 등재물
    모두 보기
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding빈티지: 2000조건: 부품 도구마지막 검증일:14일 전
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding빈티지: 1998조건: 중고마지막 검증일:60일 이상 전