설명
설명 없음환경 설정
6 and 8 inch capable comes with vacuum/coolant unit and dut unitOEM 모델 설명
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.문서
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DISCO
DFG850
카테고리
Wafer Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136542
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
6 and 8 inch capable comes with vacuum/coolant unit and dut unitOEM 모델 설명
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.문서
문서 없음