DISCO develops, manufactures, and sells precision machines and precision processing tools.

Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounted workpieces can also be added as an option.

DISCO

DAD3350

DAD321

Standard dual spindle dicing saw

Maximized throughput
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.

DFD6340

2007
Developed the "DFL7340/7360" laser saws based on a business alliance with Hamamatsu Photonics

DFL7340

2002
300 mm-compatible Fully Automatic Laser Saw DFL7160 developed.

Supports various applications, including full cut and DAF cut
Φ300 mm    Ablation

DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing.
This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.
Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism.
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface

DFL7160

DFD651

DFD641

DCS141

Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
DFD6361 offers highly consistent and dependable cut quality through
the new Synchro SpindleTM featuring superior radial rigidity. An
atomizing nozzle cleaning mechanism can also be installed in the
spinner unit as an option to effectively clean wafers after dicing

DFD6361

1993
DFD650 dual-spindle dicing saw developed.

DFD650

DAD341

A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.


Laser Saw






Discontinued Apr. 2019

DFL7020

2007
Developed the "DFD6362" dicing saw for 300 mm wafer processing.

Dicing saw for improved productivity with Φ300 mm wafers

Realizes further productivity improvement with various new functions
DFD6362 offers higher dual cut processing speed due to the shortened distance between the spindles. Enhanced axis mechanism improves the X-axis return speed and optimization of the parts used achieves higher speeds for the major transfer unit, resulting in a throughput improvement of approx. 7% compared to the previous model under the same conditions.

DFD6362

EAD 6340

DAD322

1992
DFD620 and DFD640 fully automatic dicing saws developed.

DFD640

2009
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.

Ultra compact dual-spindle automatic dicing saw

Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers

DAD3650

DAD521

DAD-2H/6

1992
DAD320 and DAD500 Series automatic dicing saws developed.

DAD320

DAD522

DAD695

DAD691

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFD6360

1987
Fully Automatic Surface Grinder DFG-82IF/8 developed.

DFG-82IF/8

Discontinued Apr. 1997
Up to 8inches wafer

DAD340

DTU152

DTU151

Supports advancements for thinner wafers
Φ200 mm         2 axes, 3 chuck tables

Wafer Thinning
Thin grinding (100 µm)
Advanced handling systems and design features facilitate high yield for thin wafer grinding.

Design flexibility
The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions.

Inherited grinding specifications with an established reputation
DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.2 t (28% less than DFG850) while maintaining the same basic specifications and performance level as the 800 series.

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFG8540

Spin cleaning and drying for workpieces processed using dicing saws

Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and drying workpieces processed using a semi-automatic dicing saw or other equipment. High-pressure cleaning with a maximum discharge pressure of 11.8 Mpa and user-created cleaning sequences (settings for the cleaning arm swing speed and spinner rotation speed) offer the optimal cleaning operation for a wide range of workpieces. In addition, the rinse cleaning, atomizing cleaning nozzle, and high performance atomizing nozzle specifications can be installed as an option. The DCS1441 can greatly reduce the number of processing particles on a wafer

DCS1441

2003
Fully Automatic Grinder/Polisher DGP8760 and Fully Automatic Multi-Mounter DFM2700 (both machines 300 mm-compatible and designed for in-line configuration with each other) developed.

DGP8760

DAD641

Supports advancements for thinner and larger wafers
Φ300 mm               2 axes, 3 chuck tables              DBG            Wafer Thinning

Inherited grinding specifications with an established reputation
DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.

Thin grinding (100 µm)
Advanced handling systems and design features facilitate high yield for thin wafer grinding.

Design flexibility
The DFG8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8160) for in-line processing solutions.




DFG8560

DAD651

2003
8"-compatible Fully Automatic Dicing Saw DFD6240 developed.

Among the World’s Smallest Single Spindle Dicing Saws

Factory-friendly design
By optimizing the frame structure and handling section layout, the footprint is on par with that of DISCO’s semi-automatic unit (DAD3350), even though it is equipped with all the functions of a fully automatic unit (size reduced by about 20% from the DFD641). The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. In addition, the condition monitor relays the processing status and key equipment information in real time for use in periodic inspections and process management.

DFD6240

Higher Dicing quality with lower environmental impact

Support for dicing quality
The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable pressure. It thereby helps manage expansion, contraction, and other undesirable phenomena caused by water temperature fluctuation.

DTU162

DAL7020

DFG841

Discontinued 	Aug. 2000

Disco DFG840 and 841 Systems With two-spindle, two-chuck table specifications and a robot arm, the 840 and 841 machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble free handling. For safety, the DFG841 complies with the EC’s CE marking and is based on the SEMI S2-93.

DFG840

Next generation dicing engine featuring dual chuck tables for improved productivity
The DFD6750 is a dicing engine that provides significantly raised productivity. It also incorporates two chuck tables to enable one table to perform cutting while the other is simultaneously transferring, aligning, and cleaning. This results in a substantial reduction in spindle processing wait time for higher productivity. The return speed of each axis is also increased for improved throughput.

DFD6750

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser
Φ150 mm        Laser Lift-off

Laser Lift-off is a technology used to detach the material layer from the substrate by irradiating a laser on the material layer formed on the substrate.DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser.
Because processing is possible in a wide focal point range with optimum power using optics uniquely developed by DISCO, wafer damage and separation are reduced. Moreover, surface roughness after sapphire separation is extremely low.
Compared to general separation equipment using gas lasers, maintenance time is drastically reduced and processing quality is more stable.

DFL7560L

DFG860

DFD681

DAD562

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm               1 axis, 1 chuck table            Planarization

Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8910

DAD681

DWT-13R II

**PARTS**

DAD650

EAD 6750

DVC010

DAD-2SP/6T

EAD 6361

DFL7260

DFD-2S/8

DAD-2H/6T

2008
Developed the "DDS2300" fully automatic die separator.

Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.

DDS2300

DVC011	

DTU1530

DFD691

DFD660

2007
Developed the "DGP8761" grinder/polisher for 300 mm wafer processing and the "DFM2800" multi-wafer mounter.

DGP8761

DFG850

DAC552

DCS140

DTU1531

DAD520

DFD620

2009
Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance.

High-quality, high-throughput standard laser grooving model
Φ300 mm       Ablation

DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use.
It performs a series of processes from HogoMax* coating and dicing to automatic cleaning.
The HogoMax coating and cleaning sections are located separately to significantly reduce waiting time.

*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface

DFL7161

2004
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness

Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification.

Improved usability and performance
Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation. In addition, all models include auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The newly developed 1.5 kW spindle, which is standard on every model, features a shaft lock function for easier blade changing. A reduced-expansion spindle (option) manufactured with special expansion-resistant materials is available for even greater precision during processing.

DAD3220

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces

High processability
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.

High maintainability
Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.

DAD3240

2004
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.

Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability

Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification.

Improved usability and performance
Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation. In addition, all models include auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The newly developed 1.5 kW spindle, which is standard on every model, features a shaft lock function for easier blade changing. A reduced-expansion spindle (option) manufactured with special expansion-resistant materials is available for even greater precision during processing.

DAD3230

DFM2700

DTU170	

Developed 2019
Die separator: Equipment used to singulate die from workpieces attached to dicing tape. First, die attach film, which is used to mount and laminate thin die, or a wafer with an internal SD layer formed after laser stealth dicing is attached to the tape. Then, the die are singulated by expanding the tape.

DDS2320

2001
Dry polishing process developed; world's first dry polisher, DFDP8140, and dry polishing wheels released.

DFDP8140

Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability
Φ200 mm            Facing dual spindle


DAD3651

Amplifier of blade breakage detector, Amplifier of non-contact setup sensor

DFD6360A

DAD-3D/8

DFD-3S/8

Focus on Functionality and Expandability
DAD3231, designed for high performance and expandability, just like the conventional DAD3230, satisfies a wide range of needs, including electronic component materials such as glasses and ceramics. Because the equipment layout was designed with additional space, DAD3231 can support workpieces up to 6 x 6 inches as an option. This makes flexible processing of user-specified workpieces possible. A linear scale can be installed on the Y-axis as an option when high-accuracy processing is required.

DAD3231

2013
Developed the DFL7361, stealth dicing laser saw, for ø300 mm wafers with support for various processes.

DFL7361

Flagship model for Φ300 mm wafers with high process extensibility

Compatible with both frame and two-way*(frame/wafer) transferring
Various processes, including full cut and half cut, can be supported with only one DFD6363. Size conversion operations can be reduced, reducing human error. Supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.

DFD6363

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

A space-saving solution for Φ300 mm dicing

16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.

DFD6560

EAD 6340K

2015
Developed the DAD3660, a dual spindle automatic dicing saw with support for workpieces as large as 360 mm x 360 mm.

Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm            Facing dual spindle              Package Singulation


DAD3660

Standard manual dicing saw for Φ8-inch workpieces 

High productivity
Improved throughput through the introduction of servo motors on all axes (X, Y, and Z).
The index accuracy has been improved by installing a Y-axis scale as a standard specification. In addition, DAD3241 includes software function enhancement, communication control through PC electric component installation, measurement accuracy improvement, and measurement time reduction using the high-speed, high-accuracy NCS (Non-Contact Setup).

DAD3241

DTG8460

DFG8390

2016
Developed DFD6310, a panel level packaging compatible dicing saw.

DFD6310

DFL7348

DAD561

2014
Developed the DAD323, the world’s smallest footprint automatic dicing saw with expanded functionality.

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components

Diversified Processes
The DAD323 is a single-axis dicing saw with a 2.0 kW high-torque spindle, compatible with workpieces as large as 6 x 6 inches. Adopting the Y-axis scale specification (optional) allows for high-precision index control and processing of difficult-to-process materials, including glass and ceramics. In addition, DAD323 is a versatile model and can be equipped with a 1.8 kW high-rotation spindle (highest rotation speed: 60,000 min-1) as an option.

DAD323

A dicing engine that provides significantly raised productivity. It also incorporates two chuck tables to enable one table to perform cutting while the other is simultaneously transferring, aligning, and cleaning.

EAD 6750S

DFD690

Space-saving layout
DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6561 is particularly ideal when installing multiple adjacent units.

DFD6561

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance

The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DCS1440

Semi-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization

DISCO

개요

활성 등재물

총 제품 수

서비스

상위 제품

DAD3350

50 등재물

DAD321

31 등재물

DFD6340

27 등재물

DFL7340

23 등재물

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