DISCO develops, manufactures, and sells precision machines and precision processing tools.

The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.

DISCO

DAD3350

The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.

DAD321

The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.

DFL7160

DFD651

The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.

DFD641

The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.

DFD6360

The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.

DFL7340

The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.

DFD6362

The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.

DFD6340

The Disco DFD6361 is a Fully Automatic Dicing Saw. It offers highly consistent and dependable cut quality through the new Synchro Spindle featuring superior radial rigidity. The DFD6361 enhances throughput in two distinct ways: DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.

DFD6361

The Disco DCS141 is a spinning unit that cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. It is appropriate for use with the automatic dicing saw (Disco DAD341) and other machines that lack a cleaning function, allowing cleaning with water and drying.

DCS141

Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.

DAD341

DFD650

EAD6340

DFD640

Realizes a throughput improvement of approx 15% compared to the DAD321. Improved machine responsiveness with the latest CPU board. Also, improve feed speed of the spindle axis by refining the axis mechanism. Equipped with an auto alignment function, which has an established reputation in higher ranking models. Also, it employs a GUI to make screen operation easy. 14% smaller footprint compared to the DAD321.

DAD322

DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."

DAD641

The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.

DFG841

The 600 Series automatic dicing saws perform package singulation with custom jigs matched perfectly to the package substrate. The substrate is held in place by a vacuum, eliminating tape costs. After singulation, substrate waste is efficiently and effectively ejected from the dicer. Workpiece placement on the chuck table is manual, but alignment is automatic. An optional mechanical spindle supports multi-blade processing for higher throughput. The DAD695 has a max workpiece size of 250x250 and a maximum stroke of 30mm for the 1.0 kW air spindle and 40mm for the 2.2kW mechanical spindle.

DAD695

The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.

DFG8560

DAD691

DAD522

DTU152

The DAD320 is an automatic dicing saw developed in 1992.

DAD320

Discontinued Apr. 1997
Up to 8inches wafer

DAD340

Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.

DFD681

DAD-2H/6

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces

High processability
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.

High maintainability
Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.

DAD3240

DFD660

The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.

DFG850

The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.

DGP8760

DTU151

DFG860

DTU1531

The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.

DFG8540

This dual dicer uses 1.0kW Synchro Spindles arranged in parallel to improve quality in step cutting and bevel cutting applications on workpieces up to ø203.2 mm (ø8") in diameter. It can handle a maximum blade size of 61 mm and is suitable for use on semiconductors, ceramics, and glass. The dual cut and step cut & bevel cut process methods effectively reduce front and backside chipping and improve die strength.

DAD651

Higher Dicing quality with lower environmental impact

Support for dicing quality
The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable pressure. It thereby helps manage expansion, contraction, and other undesirable phenomena caused by water temperature fluctuation.

DTU162

2009
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.

Ultra compact dual-spindle automatic dicing saw

Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers

DAD3650

The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.

DFG840

The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.

DGP8761

EAD6361

EAD6750

The DFD6240 is a Fully Automatic Dicing Saw developed by DISCO Corporation. It is among the world’s smallest single spindle dicing saws with a Φ200 mm Single spindle. The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. It offers highly consistent and dependable cut quality through the new Synchro Spindle™ for superior radial rigidity.

DFD6240

DAD681

The DFP8140 is a fully automatic polisher made by DISCO Corporation. It is a dry polisher for Φ8-inch wafers with chemical-free stress relief. This dry polisher can remove the grinding damage layer on the backsides of wafers up to Φ8 inches without slurry. This process greatly reduces wafer breakage and warpage and improves die strength and product yield. The DFP8140 is designed to polish wafers of diameter Φ4/5/6/8 inch (select one size) using an anomalous in-feed grinding with wafer rotation method. It uses a Φ300 mm dry polishing wheel and a porous chuck table with vacuum chuck-method. The chuck table has a revolution speed range of 0-300 min-1 and is cleaned using water & air thrust up, leveling stone and brush cleaning. The spindle has an output of 4.8 kW and a revolution speed range of 1,000-4,000 min-1. The machine dimensions are 1,200 × 2,670 × 1,800 mm (W×D×H) and it weighs approximately 1,900 kg.

DFP8140

The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.

DAG810

DTU170	

The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.

DFM2700

The Disco DFD6750 is a Fully Automatic Dicing Saw that provides significantly raised productivity. It incorporates two chuck tables to enable one table to perform cutting while the other is simultaneously transferring, aligning, and cleaning. This results in a substantial reduction in spindle processing wait time for higher productivity.

DFD6750

DAD381

The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ～ 600 mm/s.

DFL7560L

Disco’s laser application lineup supports miniaturized next generation devices. Providing the optimum ”Kiru” technology for various materials. Disco DFL7020 is a compact fully-automatic Model for sapphire processing.

DFL7020

DCS140

2014
Developed the DAD323, the world’s smallest footprint automatic dicing saw with expanded functionality.

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components

Diversified Processes
The DAD323 is a single-axis dicing saw with a 2.0 kW high-torque spindle, compatible with workpieces as large as 6 x 6 inches. Adopting the Y-axis scale specification (optional) allows for high-precision index control and processing of difficult-to-process materials, including glass and ceramics. In addition, DAD323 is a versatile model and can be equipped with a 1.8 kW high-rotation spindle (highest rotation speed: 60,000 min-1) as an option.

DAD323

DAD6450

The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.

DAD3220

DTU1530

The DAD3231 is an Evolved Compact Dicing Saw designed by Disco Corporation for high performance and expandability. It has a Φ150 mm Single spindle and can satisfy a wide range of needs, including electronic component materials such as glasses and ceramics. The equipment layout was designed with additional space, so it can support workpieces up to 6 x 6 inches as an option.

DAD3231

1987
Fully Automatic Surface Grinder DFG-82IF/8 developed.

DFG-82IF/8

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance

The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DCS1440

DAD521

DFD-2S/8

DAD520

DTU150

The DFS8910 is a fully-automatic surface planer for Φ8-inch wafers. It has 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8910

**PARTS**

DFD670

2011
Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers.

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm         2 axes, 2 chuck tables          Planarization

Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8960

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

A space-saving solution for Φ300 mm dicing

16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.

DFD6560

DVC011	

DTU1540

DAD-2SP/6T

DAD562

DWT-13R II

1992
DFD620 and DFD640 fully automatic dicing saws developed.

DFD620

The Disco DFD691 has a maximum workpiece handling size of an ø8" wafer and is equipped with a 2.2 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 76.2 mm and has a parallel dual-spindle configuration. The machine also features enhanced productivity with automatic alignment and is suitable for semiconductor, ceramic, and glass applications. It offers process methods such as dual cut and step cut & bevel cut, which effectively reduces front and backside chipping and improves die strength.

DFD691

DAD650

2008
Developed the "DDS2300" fully automatic die separator.

Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.

DDS2300

DAD-2H/6T

DVC010

DFP8160

DFG870

The Disco Corporation DAD3230 Automatic Dicing Saw is a compact dicing saw for Φ6-inch workpieces with superior expandability. It is compatible with 6 x 6-inch workpieces using a user-specified specification. It has a cutting range of 160/220 mm (optional accessory) on the X-axis and 162 mm on the Y-axis. The maximum stroke on the Z-axis is 32.2 mm (with Φ2 inch blades). The maximum rotating angle of the θ-axis is 320 degrees. The spindle has a rated output of 1.5 kW and a rated torque of 0.48 N・m.

DAD3230

Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor
wafers.
The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting. 

DFD-2D/8

The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.

DFL7361

DAD-2H/5LI

DCS-6

DAD-2H/8

The DAS8920 is a semi-automatic surface planer for Φ8-inch wafers (Φ200 mm) with 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DAS8920

DAD-2H/6TM

DAC-2SP/6

DFD690

Supports small volume grinding with high precision
Φ200 mm
1 axis, 2 chuck tables

DFG8340

DFD6860

2007
Developed the "DFL7340/7360" laser saws based on a business alliance with Hamamatsu Photonics

DFL7360

1975
Automatic Scriber/Dicing Saw DAD-2H developed and acclaimed a hit when exhibited at SEMICON West.

Discontinued 	Jan. 1978

DAD-2H

2011
Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.

DFG8830

Discontinued 	Nov. 1996
up to 12 in wafer

DAD380

1978
World's first fully automatic dicing saw DFD-2H/S, developed.

DFD-2H/S

The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.

DISCO

개요

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DAD3350

55 등재물

DAD321

40 등재물

DFL7160

31 등재물

DFD651

26 등재물

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